主办：电子工程系
报告人：潘中良教授
时间：2015年4月23日下午2:30
地点：理六栋405
题目：Three-dimensional Integrated Circuits Design: Challenges and Opportunities
摘要： The three-dimensional integrated circuits(3D IC) are able to offer significant improvements over two-dimensional circuits, and can promise a solution to the severe problems, such as reducing both footprint and interconnect length without shrinking the transistors at all. This report will introduce the principles and techniques in the System on Chip(SoC), Networks on Chip(NoC), Photonic Chip, and Three- Dimensional Integrated Circuits(3D IC).

第二阶段：NI公司关于虚拟仪器新技术的报告。

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